Intel Fab 9 and Fab 11X
Rio Rancho, NM. Packaging and test.
Intel, headquartered in Santa Clara, CA. Latest Intel news
Fab 9 advanced packaging conversion
$3.5B conversion of Rio Rancho fabs into Intel's high-volume Foveros 3D advanced packaging site, opened January 2024 and co-located with Fab 11X.
- Investment
- $3.5B
- Jobs
- 1,800
- Announced
- not stated
- Target
- Jan 2024
- Type
- Packaging and test
- Process or product
- Foveros 3D advanced packaging
- Wafer size
- not stated
- CHIPS Act funding
- $500M (converted to equity)
Timeline
- Ownership change
Intel agreed to sell the U.S. government a 9.9% stake, converting remaining CHIPS grants into equity.
Intel (SEC Form 8-K, Exhibit 99.1) - Production start
Intel opened Fab 9 in Rio Rancho as its first high-volume 3D advanced packaging site.
Silicon Semiconductor
Sources (4)
- Intel's fab roadmap examined: Arizona, Ohio, Ireland, and the two deadlines deciding 14A process node Tom's Hardware, Jun 17, 2026
- Intel and U.S. government equity investment announcement Intel (SEC Form 8-K, Exhibit 99.1), Aug 22, 2025
- Intel opens Fab 9 in New Mexico Silicon Semiconductor, Feb 1, 2024
- Intel Corporation (New Mexico) NIST CHIPS for America
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