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Intel Ohio One

New Albany, OH. Wafer fab.

Intel, headquartered in Santa Clara, CA. Latest Intel news

Ohio One (two fabs, Mod 1 and Mod 2)

Under construction as of Jun 17, 2026

Intel's two-fab leading-edge campus in Licking County, delayed to 2030-2031 completion; Intel reported $5.26B of cumulative capital spend through 2025.

Investment
$28B
Jobs
3,000
Announced
Jan 2022
Target
2030
Type
Wafer fab
Process or product
Intel 14A and future nodes
Wafer size
300mm
CHIPS Act funding
$1.5B (converted to equity)

Timeline

  1. Construction milestone

    Intel told Ohio leaders it spent over $1.53B on the site in 2025, totaling $5.26B, and finished major underground utility work.

    WHIO
  2. Ownership change

    Intel agreed to sell the U.S. government a 9.9% stake, converting remaining CHIPS grants into equity.

    Intel (SEC Form 8-K, Exhibit 99.1)
  3. Delay

    Intel pushed the first fab to 2030 completion (operations 2030-2031) and the second to 2031 completion (operations 2032).

    DatacenterDynamics
  4. Announced

    Intel announced the Ohio site; then-CEO Pat Gelsinger said spending could reach up to $100B over a decade.

    DatacenterDynamics

Sources (6)

1 supplier or contractor on record for this project

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Figures are what the company or an agency announced. "Not stated" means no source gives a number for this site. A status is only as current as its "as of" date.