Arizona State University MacroTechnology Works (wafer-level packaging center)
Tempe, AZ. R&D.
Arizona State University, headquartered in Tempe, AZ
ASU and Deca fan-out wafer-level packaging R&D center
ASU and Deca Technologies fan-out wafer-level packaging R&D center at ASU Research Park, planned to handle 200mm and 300mm device wafers and 300mm molded fan-out wafers.
- Investment
- not stated
- Jobs
- not stated
- Announced
- Mar 19, 2024
- Target
- not stated
- Type
- R&D
- Process or product
- Fan-out wafer-level packaging (200mm and 300mm device wafers, 300mm molded fan-out wafers)
- Wafer size
- 300mm
- CHIPS Act funding
- none on record
Timeline
- Announced
ASU and Deca Technologies announced North America's first fan-out wafer-level packaging R&D center, tied to the Microelectronics Commons SWAP Hub.
InBusiness Magazine
Sources (3)
- ASU and Deca team up to open research center Evertiq, Mar 20, 2024
- ASU Partnership to Pioneer North America's First R&D Center for Advanced Packaging InBusiness Magazine, Mar 19, 2024
- ASU Partnership to Pioneer North America's First R&D Center for Advanced Packaging Arizona Technology Council, Mar 19, 2024
1 supplier or contractor on record for this project
Names, roles, and the source for each are part of the paid tier we are building. Subscribe below to hear when it opens.
Get told when this site changes
Status alerts, supplier and contractor records, and a spreadsheet export are coming as a paid tier. Subscribe to the Weekly Silicon brief and we will tell you when it opens.
Other Arizona State University sites
Figures are what the company or an agency announced. "Not stated" means no source gives a number for this site. A status is only as current as its "as of" date.