Arizona State University Advanced Electronics and Photonics Core Facility

Tempe, AZ. R&D.

Arizona State University, headquartered in Tempe, AZ

ASU NAPMP advanced substrates and materials award

Announced as of Jan 16, 2025

ASU received a final $100 million NAPMP award for fan-out wafer-level processing research, including 300mm wafer and 600mm panel manufacturing, at its Tempe core facility.

Investment: not stated
Jobs: not stated
Announced: Jan 16, 2025
Target: not stated
Type: R&D
Process or product: Fan-out wafer-level processing (300mm wafer-level, 600mm panel-level)
Wafer size: 300mm
CHIPS Act funding: $100M (final award)

Timeline

Jan 16, 2025Funding
Commerce finalized a $100 million NAPMP award to ASU after a Nov 21, 2024 announcement of intent to negotiate.
NIST / U.S. Department of Commerce

Sources (2)

U.S. Department of Commerce announces $1.4 billion in final awards to support the next generation of U.S. semiconductor advanced packaging U.S. Department of Commerce, Jan 16, 2025
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging NIST / U.S. Department of Commerce, Jan 16, 2025

Get told when this site changes

Status alerts, supplier and contractor records, and a spreadsheet export are coming as a paid tier. Subscribe to the Weekly Silicon brief and we will tell you when it opens.

Other Arizona State University sites

MacroTechnology Works (wafer-level packaging center), Tempe, AZ Materials-to-Fab Center, Tempe, AZ

Figures are what the company or an agency announced. "Not stated" means no source gives a number for this site. A status is only as current as its "as of" date.