Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push

Samsung inks $200B Broadcom partnership across memory, foundry, advanced packaging.

SEOUL, July 25 : Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030.Winning long-term product…