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TSMC Fab 21 campus

Phoenix, AZ. Wafer fab, 5 projects tracked.

TSMC, headquartered in Hsinchu, Taiwan. Latest TSMC news

Fab 21 Phase 1

Operating as of Jan 15, 2026

First TSMC fab at its north Phoenix campus, producing N4-class logic chips and in volume production since late 2024.

Investment
not stated
Jobs
not stated
Announced
May 2020
Target
2024
Type
Wafer fab
Process or product
4nm, 5nm FinFET
Wafer size
300mm
CHIPS Act funding
Shared with other sites (final award)

Timeline

  1. Funding

    Commerce finalized a CHIPS award of up to $6.6B plus up to $5B in proposed loans for TSMC Arizona's three fabs.

    NIST CHIPS for America
  2. Production start

    Volume production of 4nm chips began at the first Arizona fab in late 2024.

    Greater Phoenix Economic Council
  3. Delay

    TSMC delayed the first Arizona fab opening from late 2024 to 2025, citing a shortage of specialized labor.

    Manufacturing Dive
  4. Announced

    TSMC announced plans for its first Arizona fab.

    Greater Phoenix Economic Council

Sources (5)

Fab 21 Phase 2

Under construction as of Jan 15, 2026

Second TSMC Phoenix fab for 3nm FinFET plus 2nm and A16 nanosheet technologies; construction complete, tool move-in set for 2026 and volume output expected in 2H 2027.

Investment
not stated
Jobs
not stated
Announced
2022
Target
2027
Type
Wafer fab
Process or product
3nm, 2nm, A16
Wafer size
300mm
CHIPS Act funding
Shared with other sites (final award)

Timeline

  1. Construction milestone

    TSMC's CEO said the second fab is complete, tool move-in is scheduled for 2026 and high-volume output is expected in 2H 2027.

    TrendForce
  2. Update

    Nikkei-sourced reports said TSMC plans tool installation in Jul-Sep 2026 and 3nm production in 2027, versus 2028 previously.

    TrendForce
  3. Delay

    TSMC's CEO said the second Arizona fab would open in 2027 or 2028, at least a year later than first announced.

    Manufacturing Dive

Sources (4)

Fab 21 Phase 3

Under construction as of Jan 15, 2026

Third TSMC Phoenix fab for 2nm and A16 processes; groundbreaking was April 2025 and construction was underway as of January 2026.

Investment
not stated
Jobs
not stated
Announced
Apr 2024
Target
not stated
Type
Wafer fab
Process or product
2nm, A16
Wafer size
300mm
CHIPS Act funding
Shared with other sites (final award)

Timeline

  1. Construction milestone

    TSMC said at its Q4 2025 earnings call that third-fab construction was underway.

    TrendForce
  2. Groundbreaking

    TSMC broke ground on its third Phoenix fab with U.S. Commerce Secretary Howard Lutnick attending.

    Orion Property Group (news repost)

Sources (4)

Advanced packaging facilities (Arizona)

Under construction as of Apr 22, 2026

TSMC's first U.S. advanced packaging plant (CoWoS and 3D-IC) in an existing Arizona facility; construction has begun and operation is targeted before 2029. Plan calls for two packaging facilities.

Investment
not stated
Jobs
not stated
Announced
Mar 4, 2025
Target
2029
Type
Packaging and test
Process or product
CoWoS, 3D-IC advanced packaging
Wafer size
not stated
CHIPS Act funding
none on record

Timeline

  1. Construction milestone

    TSMC executives said construction of the first Arizona advanced packaging plant has begun; TSMC said in January it was applying for permits.

    Reuters (via WHBL)
  2. Announced

    TSMC announced two advanced packaging facilities as part of its expanded U.S. plan.

    TSMC

Sources (3)

Fabs 4 to 6 (March 2025 expansion)

Announced as of Jan 15, 2026

Three additional Phoenix fabs announced in March 2025 as part of a $100B plan; permits for the fourth fab were being sought and an extra land parcel was bought in early 2026.

Investment
not stated
Jobs
not stated
Announced
Mar 4, 2025
Target
not stated
Type
Wafer fab
Process or product
2nm, A16 and more advanced
Wafer size
300mm
CHIPS Act funding
none on record

Timeline

  1. Update

    TSMC disclosed a $197M purchase of an additional Arizona land parcel and said it was seeking permits for a fourth fab and first packaging facility.

    TrendForce
  2. Announced

    TSMC announced an additional $100B in U.S. investment for three new fabs, two advanced packaging facilities and an R&D center.

    TSMC

Sources (4)

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Other TSMC sites

Arizona expansion (site not specified), AZ (site not disclosed)

Figures are what the company or an agency announced. "Not stated" means no source gives a number for this site. A status is only as current as its "as of" date.