Texas Institute for Electronics TIE NGMM Center
Austin, TX. R&D.
Texas Institute for Electronics, headquartered in Austin, TX
DARPA NGMM 3D heterogeneous integration center
UT Austin's Texas Institute for Electronics is converting a 1980s Austin fab into DARPA's open-access 3D heterogeneous integration R&D and pilot production center.
- Investment
- not stated
- Jobs
- not stated
- Announced
- Jul 2024
- Target
- 2029
- Type
- R&D
- Process or product
- 3D heterogeneous integration advanced packaging
- Wafer size
- not stated
- CHIPS Act funding
- none on record
Timeline
- Equipment install
IEEE Spectrum reported tools were being installed, with all fab tools expected in place in Q1 2026.
IEEE Spectrum - Funding
DARPA awarded NGMM Phase 1 to the UT Austin Texas Institute for Electronics; Phase 1 kickoff followed in September 2024.
DARPA
Sources (4)
- DARPA and Texas Bet $1.4 Billion on a Unique Foundry IEEE Spectrum, Nov 10, 2025
- DARPA Selects UT For 3D Packaging R&D Center Mark LaPedus, Jul 28, 2024
- Next-Generation Microelectronics Manufacturing (NGMM) DARPA
- University of Texas at Austin to house microelectronics manufacturing hub southwest.mtseries.com
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