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SK hynix Purdue Research Park site
West Lafayette, IN. Packaging and test.
SK hynix, headquartered in Icheon, South Korea. Latest SK hynix news
West Lafayette HBM packaging plant and R&D facility
Announced as of Dec 19, 2024
HBM back-end packaging plant and advanced packaging R&D line at the Purdue Research Park; $3.87B planned, mass production targeted for second half of 2028.
- Investment
- $3.9B
- Jobs
- 1,000
- Announced
- not stated
- Target
- 2028
- Type
- Packaging and test
- Process or product
- HBM advanced packaging
- Wafer size
- not stated
- CHIPS Act funding
- $458M (final award)
Timeline
- Funding
Commerce and SK hynix signed a preliminary memorandum of terms for CHIPS funding.
NIST CHIPS for America
Sources (2)
- Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix NIST CHIPS for America, Dec 19, 2024
- SK hynix (Indiana) NIST CHIPS for America
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Figures are what the company or an agency announced. "Not stated" means no source gives a number for this site. A status is only as current as its "as of" date.