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Micron Boise campus

Boise, ID. Wafer fab, 2 projects tracked.

Micron, headquartered in Boise, ID. Latest Micron news

Boise ID2 (second fab)

Announced as of Oct 2, 2026

Second new Boise DRAM fab, announced in June 2025 as part of a $30B added commitment that also covers the Manassas, VA expansion and HBM packaging; Micron expects first wafer output in late 2028.

Investment
not stated
Jobs
not stated
Announced
Jun 12, 2025
Target
2028
Type
Wafer fab
Process or product
Leading-edge DRAM, HBM
Wafer size
300mm
CHIPS Act funding
Shared with other sites (final award)

Timeline

  1. Announced

    Micron announced a $200B U.S. plan that includes a second Boise fab.

    Manufacturing Dive

Sources (4)

Boise ID1 (first new fab)

Under construction as of Oct 2, 2026

Micron's first new Boise DRAM fab, co-located with its R&D facility; under construction with first wafer output pulled in to mid-2027.

Investment
$25B
Jobs
not stated
Announced
not stated
Target
2027
Type
Wafer fab
Process or product
Leading-edge DRAM
Wafer size
300mm
CHIPS Act funding
Shared with other sites (final award)

Timeline

  1. Construction milestone

    Micron said ID1 remains on track for first wafer output in mid-2027.

    KBOI / Idaho News
  2. Update

    Management said Idaho 1 wafer output was brought forward from 2H 2027 to mid-2027.

    TrendForce
  3. Expansion

    Micron expanded its U.S. plan to $200B, including a $30B second Boise fab; the first Idaho fab was said to be on track for DRAM production in 2027.

    Manufacturing Dive

Sources (4)

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Figures are what the company or an agency announced. "Not stated" means no source gives a number for this site. A status is only as current as its "as of" date.