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Calumet Electronics Center for Advanced Substrate Technology (CAST)

Calumet, MI. Packaging and test.

Calumet Electronics, headquartered in Calumet, MI

Organic package substrate plant (CAST)

Operating as of Sep 8, 2026

Calumet Electronics built a 60,000 sq ft organic package substrate plant with Class 1000 cleanrooms; CAST was unveiled Sept 3, 2026 as the first U.S. panel-level organic substrate facility.

Investment
$51M
Jobs
not stated
Announced
Oct 2023
Target
not stated
Type
Packaging and test
Process or product
organic build-up package substrates (HDBU)
Wafer size
not stated
CHIPS Act funding
none on record

Timeline

  1. Update

    Calumet unveiled its Center for Advanced Substrate Technology (CAST), described as the first dedicated panel-level organic substrate facility in the U.S.

    I-Connect007
  2. Funding

    The Department of Defense awarded Calumet $39.9M under DPA Title III for high-density build-up substrates.

    3D InCites
  3. Funding

    Michigan Strategic Fund approved a $7.5M Michigan Business Development Program grant for a nearly $51M substrate facility.

    Upper Michigan's Source

Sources (5)

1 supplier or contractor on record for this project

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Figures are what the company or an agency announced. "Not stated" means no source gives a number for this site. A status is only as current as its "as of" date.