Semiconductor News

How chips get made: process nodes, lithography, advanced packaging, fab capacity, and foundry economics. From TSMC and Intel roadmaps to CHIPS Act build-outs in Arizona, Ohio, and Texas, this hub collects every manufacturing story our AI editor has scored and ranked.

• TSMC Uses Old Fabs to Make New Chips [video]Aug 17, 2026 · youtube.com · scored 3.30/10 · day ranking →
• Semiconductor X-ray metrology reveals unseen defects in complex chipsAug 28, 2026 · Interesting Engineering · scored 3.30/10 · day ranking →
• Researchers create programmable material that can steer heat and remember its state without power — breakthrough could eventually aid AI chip cooling and silicon photonicsJul 15, 2026 · Tom's Hardware UK · scored 3.30/10 · day ranking →
• Can Intel finally beat ARM on performance per Watt?Aug 9, 2026 · hackaday.com · scored 3.30/10 · day ranking →
• A New AI Shortage Is Coming. One CEO Just Predicted it Will Be “Bigger Than Memory.”Jul 29, 2026 · 24/7 Wall St. · scored 3.30/10 · day ranking →
• (PR) NVIDIA Harnesses Vera CPU to Speed Up Design of Next-Generation CPUs and GPUsJul 28, 2026 · Techpowerup.com · scored 3.30/10 · day ranking →
• AEM CEO says AI upends semiconductor testingMay 7, 2026 · Digitimes · scored 3.30/10 · day ranking →
• Hygon Reveals 512-Thread CPU and AI GPU to Rival Intel Xeon and NvidiaJul 31, 2026 · ubergizmo.com · scored 3.30/10 · day ranking →
• Semiconductor technologies for sub-1nm chips ...Jul 21, 2026 · eeNews Europe · scored 3.30/10 · day ranking →
• AMD pivots from HBM to LPDDR5X for new Versal Gen 2 memory on package chipsJul 4, 2026 · servethehome.com · scored 3.25/10 · day ranking →
• Exclusive: Samsung plans $1.5 billion chip testing plant in Vietnam, document showsMay 27, 2026 · Reuters · scored 3.25/10 · day ranking →
• Scientists built a memory chip that breaks the rules of miniaturizationMay 4, 2026 · Science Daily · scored 3.25/10 · day ranking →
• Silicon Valley clashes over open-source technologyAug 2, 2026 · The Hill · scored 3.25/10 · day ranking →
• ASE's Huang urges AI profits to fund R&D for CPO, PLPAug 25, 2026 · Digitimes · scored 3.25/10 · day ranking →
• BBCube: a novel chip-on-wafer technology for next-generation AI chip integrationAug 13, 2026 · eurekalert.org · scored 3.25/10 · day ranking →
• Huawei Unveils New Chip Design Amid Semiconductor PushMay 25, 2026 · StratNews Global · scored 3.25/10 · day ranking →
• Interview: Why Geckos bets materials, not chips, will decide the next AI performance leapJul 12, 2026 · Digitimes · scored 3.25/10 · day ranking →
• Advantest and OpenLight join forces on silicon photonics test platform for mass productionJul 6, 2026 · Digitimes · scored 3.25/10 · day ranking →
• How AI Is Reshaping the Global Semiconductor Patent LandscapeSep 1, 2026 · EE Times · scored 3.25/10 · day ranking →
• Tower Semiconductor to invest $3 billion in Japan, backed by government grantsJul 15, 2026 · Yahoo Entertainment · scored 3.25/10 · day ranking →
• Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguidesJul 8, 2026 · Digitimes · scored 3.25/10 · day ranking →
• Display to semiconductor: Panel makers weaponize large glass substrates for FOPLPJun 3, 2026 · Digitimes · scored 3.25/10 · day ranking →
• The huge potential of the compound semiconductor cluster in South WalesJun 2, 2026 · Business Live · scored 3.25/10 · day ranking →
• Is Huawei’s new chip scaling law a true breakthrough, or mere hype?Jun 1, 2026 · South China Morning Post · scored 3.25/10 · day ranking →
• Chip Fab-in-a-Box Could Democratize SemiconductorsMay 6, 2026 · IEEE Spectrum · scored 3.25/10 · day ranking →
• Hot Chips 2026: CUDA Targets RISC-V – By Chester LamAug 24, 2026 · chipsandcheese.com · scored 3.20/10 · day ranking →
• US semiconductor giant breaks ground on $9.3-billion memory chip plant expansion in JapanJul 7, 2026 · Interesting Engineering · scored 3.20/10 · day ranking →
• Xiaomi taps TSMC to make chips for foldables, AI and autonomous drivingAug 25, 2026 · Digitimes · scored 3.20/10 · day ranking →
• TSMC turns to OSATs for more CoW capacity as AI packaging bottleneck persistsAug 7, 2026 · Digitimes · scored 3.20/10 · day ranking →
• Tokyo Electron's close ties with TSMC at risk after chip tech leakApr 29, 2026 · Nikkei Asia · scored 3.20/10 · day ranking →
• Preparing For AI-Driven Chip Design And VerificationJul 28, 2026 · Semiconductor Engineering · scored 3.20/10 · day ranking →
• AI chip boom shifts bottleneck to advanced packaging, says AT&S CEOJul 29, 2026 · Nikkei Asia · scored 3.20/10 · day ranking →
• MediaTek Says Its Next-Gen Program Will Only Use Intel’s EMIB-T For PackagingJun 3, 2026 · Wccftech · scored 3.20/10 · day ranking →
• SK Hynix reportedly buys Silicon Valley property to bolster AI supply chainMay 13, 2026 · Digitimes · scored 3.15/10 · day ranking →
• Memory giants race to expand AI chip capacityJul 12, 2026 · The Korea Herald · scored 3.15/10 · day ranking →
• China’s semiconductor industry is racing to catch the West’sJul 7, 2026 · The Economist · scored 3.15/10 · day ranking →
• Exclusive: IC design faces wire bonding bottleneck in 2027Aug 29, 2026 · Digitimes · scored 3.15/10 · day ranking →
• AI chip strategies echo StarCraft factions as memory bottleneck reshapes the raceAug 21, 2026 · Digitimes · scored 3.15/10 · day ranking →
• Transparent silicon-photonics chips could bring advanced optical systems to curved displaysSep 5, 2026 · Tech Xplore · scored 3.15/10 · day ranking →