Semiconductor News

How chips get made: process nodes, lithography, advanced packaging, fab capacity, and foundry economics. From TSMC and Intel roadmaps to CHIPS Act build-outs in Arizona, Ohio, and Texas, this hub collects every manufacturing story our AI editor has scored and ranked.

• Innolux targets advanced packaging with debut of Chip Last techSep 3, 2026 · Digitimes · scored 3.75/10 · day ranking →
• Silicon Valley clashes over open-source technologyAug 7, 2026 · The Hill · scored 3.75/10 · day ranking →
• Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection toolsSep 4, 2026 · Digitimes · scored 3.75/10 · day ranking →
• Tata's India chip fab faces leadership churn and engineering hurdles amid uneven but continuing progressApr 28, 2026 · digitimes · scored 3.75/10 · day ranking →
• Top U.S. official to attend construction milestone at Micron’s semiconductor plant in Central NYJul 8, 2026 · Syracuse · scored 3.70/10 · day ranking →
• Intel and Lens Technology collaborate on advanced AI chip packagingJul 27, 2026 · eeNews Europe · scored 3.70/10 · day ranking →
• China team cuts 3D optical chip production time from hours to seconds, and it matters for crypto’s AI hardware raceJul 20, 2026 · Crypto Briefing · scored 3.70/10 · day ranking →
• Chinese chip start-up launches 8-inch production line pilot for 2D chipsJul 12, 2026 · South China Morning Post · scored 3.70/10 · day ranking →
• Giant stride with micron precision: Inside India’s 1st semiconductor chip packaging cluster in GujaratMay 14, 2026 · ThePrint · scored 3.70/10 · day ranking →
• Meta reuses old RAM in new servers with custom bridge chipJul 9, 2026 · networkworld.com · scored 3.70/10 · day ranking →
• Transparent silicon-photonics chips could bring advanced optical systems to curved displaysSep 4, 2026 · Tech Xplore · scored 3.70/10 · day ranking →
• Merck ramps up AI semiconductor materials push as Level Up nears completionJul 21, 2026 · Digitimes · scored 3.70/10 · day ranking →
• Chinese Firm Naura Claims Big Breakthrough That Could Enable CXMT To Overcome EUV Sanctions & Make 3D DRAM ChipsSep 4, 2026 · Wccftech · scored 3.70/10 · day ranking →
• Intel’s EMIB-T Packaging Pulls Two More Taiwanese Suppliers Into Google’s TPU Orbit as TSMC’s CoWoS StrainsJun 3, 2026 · Wccftech · scored 3.70/10 · day ranking →
• Kioxia outlines plan to capture AI demand with its new high-speed memory chipSep 4, 2026 · Nikkei Asia · scored 3.70/10 · day ranking →
• The Chip That Made Hardware RewriteableMay 5, 2026 · IEEE Spectrum · scored 3.70/10 · day ranking →
• Quantum-tunneling field-effect transistor overcomes barriers to integrated-circuit chip developmentSep 3, 2026 · Tech Xplore · scored 3.70/10 · day ranking →
• Taiwan's MediaTek partners with Intel and TSMC for advanced chip packagingMay 29, 2026 · Nikkei Asia · scored 3.70/10 · day ranking →
• SK Hynix plans to triple wafer capacity by 2034 to meet AI demandJun 12, 2026 · Crypto Briefing · scored 3.65/10 · day ranking →
• Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPsSep 2, 2026 · digitimes · scored 3.65/10 · day ranking →
• "India has entered new semiconductors era": Ashwini Vaishnaw as CG semi OSAT plant starts commercial production in SanandJul 6, 2026 · The Times of India · scored 3.65/10 · day ranking →
• Chip Fab-in-a-Box Could Democratize SemiconductorsMay 8, 2026 · IEEE Spectrum · scored 3.65/10 · day ranking →
• ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029May 12, 2026 · Digitimes · scored 3.65/10 · day ranking →
• TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planningSep 4, 2026 · Digitimes · scored 3.65/10 · day ranking →
• Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chainsJul 14, 2026 · Digitimes · scored 3.60/10 · day ranking →
• Exclusive-CXMT plans second chip plant in Beijing and is in talks on its funding, sources sayAug 4, 2026 · Yahoo Entertainment · scored 3.60/10 · day ranking →
• CXMT Eyes Second Beijing Memory Fab After Record IPO, Circling the Gap Samsung and Micron Left BehindAug 4, 2026 · Wccftech · scored 3.60/10 · day ranking →
• [Tech Note] Hybrid Bonding: Evolving into a Foundational Technology for Improving Semiconductor PerformanceAug 25, 2026 · SK hynix · scored 3.55/10 · day ranking →
• Zinc oxide-tellurium semiconductor reduces chip complexity by 75%Jun 6, 2026 · Interesting Engineering · scored 3.55/10 · day ranking →
• Photonics Forces A Chiplet RethinkSep 1, 2026 · Semiconductor Engineering · scored 3.55/10 · day ranking →
• New lithography system promises faster chip prototyping without masksJul 27, 2026 · Interesting Engineering · scored 3.55/10 · day ranking →
• On-Device AI In Smartphones Is A Blatant Lie Due To Packaging & DRAM Limitations, But SK hynix’s Newest Architecture Breakthrough Could Change ThatJul 25, 2026 · Wccftech · scored 3.55/10 · day ranking →
• Chip Industry Week In ReviewAug 14, 2026 · semiengineering · scored 3.55/10 · day ranking →
• Data movement is the new performance battleground in semiconductor designAug 12, 2026 · TechRadar · scored 3.55/10 · day ranking →
• Preparing For AI-Driven Chip Design And VerificationJul 27, 2026 · Semiconductor Engineering · scored 3.55/10 · day ranking →
• 12 semiconductor plants approved: Where India’s chip manufacturing mission stands, what’s nextJun 15, 2026 · The Indian Express · scored 3.55/10 · day ranking →