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PolicyCA / Silicon Valley·Ranked Friday, July 31, 2026
Extropic Signs $75 Million Letter of Intent with U.S. Department of Commerce to Scale and Onshore Thermodynamic Computing
Extropic wins $75M CHIPS R&D funding to scale thermodynamic computing domestically.
“Planned CHIPS R&D funding to scale Extropic's Thermodynamic Sampling Units for AI workloads and fabricate them at an American foundry. SAN FRANCISCO and WALTHAM, Mass.,…”
AI score breakdown
#3 that day5.55/ 10
Technology breakthrough · weight 30%5/10
Economic impact · weight 25%6/10
Job impact · weight 20%4/10
Regional relevance · weight 15%7/10
Policy & geopolitics · weight 10%7/10
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