TSMC Can’t Keep Up With CoWoS Demand, Sending Advanced Packaging Orders Spilling Over To Intel & Rival Taiwanese Fabs

TSMC CoWoS capacity constraints redirect advanced packaging orders to Intel, rivals.

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand. Intel & Other Advanced Packaging Chip Man…